Computational Prototyping Tools and Techniques

Contains reports on five research projects.Industry Consortium (Mobil, Statoil, DNV Software, Shell, OTRC, Petrobras, NorskHydro, Exxon, Chevron, SAGA, NSWC)U.S. Navy - Office of Naval ResearchAnalog DevicesDefense Advanced Research Projects Agency Contract J-FBI-95-215Cadence Design SystemsHarris SemiconductorMAFET ConsortiumMotorola SemiconductorDefense Advanced Research Projects AgencyMultiuniversity Research InitiativeSemiconductor Research CorporationIBM Corporatio

Custom Integrated Circuits

Contains table of contents for Part III, table of contents for Section 1 and reports on eleven research projects.IBM CorporationMIT School of EngineeringNational Science Foundation Grant MIP 94-23221Defense Advanced Research Projects Agency/U.S. Army Intelligence Center Contract DABT63-94-C-0053Mitsubishi CorporationNational Science Foundation Young Investigator Award Fellowship MIP 92-58376Joint Industry Program on Offshore Structure AnalysisAnalog DevicesDefense Advanced Research Projects AgencyCadence Design SystemsMAFET ConsortiumConsortium for Superconducting ElectronicsNational Defense Science and Engineering Graduate FellowshipDigital Equipment CorporationMIT Lincoln LaboratorySemiconductor Research CorporationMultiuniversity Research IntiativeNational Science Foundatio

Numerical simulation to optimize the efficiency of HTM-free perovskite solar cells by ETM engineering

Perovskite solar cells based on carbon electrodes (c-PSCs) without a hole transport material (HTM) have gained considerable interest owing to their cost-effective and simplified structure. However, their application is constrained by a combination of low efficiency and the prevalence of electron transport materials (ETMs), e.g., TiO2, which undergo extreme temperatures during their manufacturing processes. TiO2 also has poor optoelectronic properties, such as low conductivity and mobility. Additionally, when exposed to UV light, TiO2 susceptibility to photocatalysis reduces the materials long-term stability. In present study, an HTM-free device based on FTO/TiO2/CH3NH3PbI3/carbon structure is employed and studied using a one-dimensional Solar Cell Capacitance Simulator (SCAPS-1D). Initially, the design is studied while employing inorganic ETMs, including CdZnS, WS2, WO3, ZnO, ZnOS, and ZnSe, by substituting TiO2, and the impact of each ETM on device performance is evaluated. After ETM optimization, various parameters that affect device performance, such as ETM and absorber thicknesses, doping concentrations, charge carriers mobility, and defect densities at ETM/perovskite interface, have been studied. Under optimized parameters, the design having ZnSe as ETM yields the best results with a Voc of 1.25 V, Jsc of 24.77 mA/cm2, FF of 86.29 %, and PCE of 26.76 %. The presented results thus add more promise and confidence to the ongoing quest for carbon-based, HTM-free PSCs

Custom Integrated Circuits

Contains table of contents for Part III, table of contents for Section 1 and reports on ten research projects.IBM CorporationNational Science FoundationNational Science Foundation/Advanced Research Projects Agency Grant MIP 91-17724Advanced Research Projects Agency/U.S. Navy - Office of Naval Research Contract N00014-94-1-0985U.S. Navy Contract N00174-93-C-0035Analog Devices, Inc.Federal Bureau of Investigation Contract J-FBI-92-196Advanced Research Projects Agency/Consortium for Superconducting Electronics Contract MDA972-90-C-0021National Defense Science and Engineering Graduate FellowshipDigital Equipment CorporationSemiconductor Research Corporation Contract SRC 93-SJ-360U.S. Navy - Office of Naval Research Contract N00014-91-J-1698National Science Foundation/Advanced Research Projects Agency Grant MIP 91-17724Semiconductor Research Corporation Contract SRC 93-SJ-558Advanced Research Projects Agency/U.S. Army Intelligence Center Contract DABT63-94-C-0053National Science Foundation Young Investigator AwardMitsubishi Corporation Fellowship MIP 92-5837

Custom Integrated Circuits

Contains table of contents for Part III, table of contents for Section 1, and reports on twelve research projects.IBM CorporationMIT School of EngineeringNational Science Foundation Grant MIP 94-23221Defense Advanced Research Projects Agency/U.S. Army Intelligence Center Contract DABT63-94-C-0053Mitsubishi CorporationNational Science Foundation/Young Investigator Award Fellowship MIP 92-58376Defense Advanced Research Projects Agency/ U.S. Navy - Office of Naval Research Contract N00014-94-1-0985National Science Foundation Grant MIP 91-17724U.S. Navy - Office of Navel Research Contract N00174-93-K-0035Analog Devices CorporationFederal Bureau of Investigation Contract J-FBI-92-196Defense Advanced Research Projects Agency/Consortium for Superconducting Electronics Contract MDA 972-90-C-0021National Defense Science and Engineering Graduate FellowshipDefense Advanced Research Projects Agency Contract DABT63-94-C-0053Digital Equipment CorporationMIT Lincoln LaboratorySemiconductor Research Corporation Contract SRC 95-SJ-558U.S. Army Contract DABT63-95-C-0088Motorola Corporatio